Through Hole Printed Circuit Board Assembly Multilayer PCB ICT Testing

1

layer

1-30?layer

2

Material

CEM-1,?CEM-3?FR-4,?FR-4?High?TG,?Polyimide,?Aluminum-based?material.?

3

Board?thickness

0.2mm-6mm

4

Max.finished?board?size

800*508mm

5

Min.drilled?hole?size

0.25mm

6

min.line?width

0.075mm(3mil)

7

min.line?spacing

0.075mm(3mil)

8

Surface?finish

HAL,?HAL?Lead?free,Immersion?Gold/?Silver/Tin,?Hard?Gold,?OSP

9

Copper?thickness

0.5-4.0oz

10

Solder?mask?color

green/black/white/red/blue/yellow

11

Inner?packing

Vacuum?packing,Plastic?bag

12

Outer?packing

standard?carton?packing

13

Hole?tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling?punching

Routing,V-CUT,Beveling

1

Type?of?Assembly

SMT?and?Thru-hole

2

Solder?Type

Water?Soluble?Solder?Paste,Leaded?and?Lead-Free

3

Components

Passives?Down?to?0201?Size

BGA?and?VFBGA

Leadless?Chip?Carries/CSP

Double-Sided?SMT?Assembly

Fine?Pitch?to?08?Mils

BGA?Repair?and?Reball

Part?Removal?and?Replacement-Same?Day?Service

3

Bare?Board?Size

Smallest:0.25x0.25?Inches

Largest:20x20?Inches

4

File?Formats

Bill?of?Materials?

Gerber?Files

Pick-N-Place?File(XYRS)

5

Type?of?Service

Turn-Key,Partial?Turn-Key?or?Consignment

6

Component?Packaging

Cut?Tape

Tube

Reels

Loose?Parts

7

Turn?Time

15?to?20?days?

8

Testing

AOI?inspection

X-Ray?inspection

In-Circuit?testing

Functional?test